Structure to prevent lateral epitaxial growth in semiconductor devices

ABSTRACT

A method for preventing epitaxial growth in a semiconductor device is described. The method includes cutting the fins of FinFET structure to form a set of exposed fin ends. A set of sidewall spacers are formed on the set of exposed fin ends, forming a set of spacer covered fin ends. The set of sidewall spacers prevent epitaxial growth at the set of spacer covered fin ends. A semiconductor device includes a set of fin structures having a set of fin ends. A set of inhibitory layers are disposed at the set of fin ends to inhibit excessive epitaxial growth at the fin ends.

BACKGROUND OF THE INVENTION

This disclosure relates to integrated circuit devices, and morespecifically, to a method and structure to prevent epitaxial growth insemiconductor devices.

As the dimensions of modern integrated circuitry in semiconductor chipscontinue to shrink, conventional semiconductor processing isincreasingly challenged to make structures at finer dimensions. Planarfield effect transistor (FET) technology has become constrained atsmaller geometries due to leakage effects. The semiconductor industryhas found an alternative approach to planar FETs with fin field effecttransistors (FinFETs) to reduce leakage current in semiconductordevices. In a FinFET, an active region including the drain, the channelregion and the source protrudes up from the surface of the semiconductorsubstrate upon which the FinFET is located. Due to the many superiorattributes, especially in the areas of device performance, off-stateleakage and foot print, FinFETs are replacing planar FETs, to enable thescaling of gate lengths to 14 nm and below. In addition, a type ofFinFET called a multiple gate field-effect transistor, or MuGFET, isoften used in logic devices.

A typical static random-access memory (static RAM or SRAM)), whenimplemented in FinFETs, is comprised of three different types ofFinFETs: pull-up (PU) FinFETs, pass-gate (PG) FinFETs, and pull-down(PD) FinFETs. In dimensions of 14 nm and below, the pull up FinFETactive distance is one of factors which limit the density of theintegrated circuit. The PU FinFET to PU FinFET epitaxy short is an SRAMand logic device yield issue.

BRIEF SUMMARY

According to this disclosure, a structure and method for constructingthe structure are described. In one aspect of the invention, a methodfor preventing epitaxial growth in a semiconductor device includescutting the fins of FinFET structure to form a set of exposed fin ends.A set of sidewall spacers are formed on the set of exposed fin ends,forming a set of spacer covered fin ends. The set of sidewall spacersprevent epitaxial growth at the set of spacer covered fin ends. Inanother aspect of the invention, a semiconductor device includes a setof fin structures having a set of fin ends. A set of inhibitory layersare disposed at the set of fin ends to inhibit excessive epitaxialgrowth at the fin ends.

The foregoing has outlined some of the more pertinent features of thedisclosed subject matter. These features should be construed to bemerely illustrative. Many other beneficial results can be attained byapplying the disclosed subject matter in a different manner or bymodifying the invention as will be described.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present invention and theadvantages thereof, reference is now made to the following descriptionstaken in conjunction with the accompanying drawings which are notnecessarily drawing to scale, and in which:

FIG. 1 is a top view of an SRAM device comprised of a plurality ofFinFETs;

FIG. 2 is a cross-sectional diagram depicting fin formation in theprocess of fabricating a FinFET according to a first embodiment of theinvention;

FIG. 3 is a cross-sectional diagram depicting the FinFET structure afterthe local shallow trench isolation (STI) and chemical mechanicalpolishing (CMP) processes according to a first embodiment of theinvention;

FIG. 4 is a cross-sectional diagram depicting the FinFET structure afterthe deep STI process according to a first embodiment of the invention;

FIG. 5 is a cross-sectional diagram depicting the FinFET structure afterthe deep STI deposition and chemical mechanical polishing (CMP)processes according to a first embodiment of the invention;

FIGS. 6A and 6B are respectively cross-sectional and perspectivediagrams depicting the FinFET structure after patterning and etching toreveal the fin end of the FinFET structure according to a firstembodiment of the invention;

FIGS. 7A and 7B are respectively cross-sectional and perspectivediagrams depicting the

FinFET structure after sidewall spacer formation to avoid excessiveepitaxial growth in the fin end according to a first embodiment of theinvention;

FIGS. 8A and 8B are respectively cross-sectional and perspectivediagrams depicting the FinFET structure after an etch process of anoxide layer to reveal the protected fin structure (fin recess) forfurther processing according to a first embodiment of the invention; and

FIGS. 9A and 9B are respectively cross-sectional and perspectivediagrams depicting the FinFET structure after plasma nitridation andhigh dose implantation to avoid excessive epitaxial growth in the finend according to a second embodiment of the invention.

DETAILED DESCRIPTION OF THE DRAWINGS

At a high level, the invention includes a structure and method forfabricating the structure for preventing excessive epitaxial growth onthe fin end of a FinFET device, e.g., both for logic FinFETs or for apull-up FinFET or pFinFET in SRAM. A sidewall spacer is fabricated atthe fin end to prevent the silicon of the fin end from providing a“seed” for epitaxial growth at the fin end where it is not needed, whileallowing epitaxial silicon to grow on the fin sides for the source anddrain of the FinFET. In an alternative embodiment, the exposed fin endis treated with plasma nitridation and/or high dose implantationprocesses to create an inhibitory layer to prevent epitaxial growth atthe fin end.

A “substrate” as used herein can comprise any material appropriate forthe given purpose (whether now known or developed in the future) and cancomprise, for example, Si, SiC, SiGe, SiGeC, Ge alloys, GaAs, InAs, TnP,other III-V or II-VI compound semiconductors, or organic semiconductorstructures, etc.

For purposes herein, a “semiconductor” is a material or structure thatmay include an implanted impurity that allows the material to sometimesbe conductive and sometimes be a non-conductive, based on electron andhole carrier concentration. As used herein, “implantation processes” cantake any appropriate form (whether now known or developed in the future)and can comprise, for example, ion implantation, etc.

For purposes herein, an “insulator” is a relative term that means amaterial or structure that allows substantially less (<95%) electricalcurrent to flow than does a “conductor.” The dielectrics (insulators)mentioned herein can, for example, be grown from either a dry oxygenambient or steam and then patterned. Alternatively, the dielectricsherein may be formed from any of the many candidate high dielectricconstant (high-k) materials, including but not limited to hafnium oxide,aluminum oxide, silicon nitride, silicon oxynitride, a gate dielectricstack of SiO2 and Si3N4, and metal oxides like tantalum oxide that haverelative dielectric constants above that of SiO2 (above 3.9). Thethickness of dielectrics herein may vary contingent upon the requireddevice performance. The conductors mentioned herein can be formed of anyconductive material, such as polycrystalline silicon (polysilicon),amorphous silicon, a combination of amorphous silicon and polysilicon,and polysilicon-germanium, rendered conductive by the presence of asuitable dopant. Alternatively, the conductors herein may be one or moremetals, such as tungsten, hafnium, tantalum, molybdenum, titanium, ornickel, or a metal silicide, any alloys of such metals, and may bedeposited using physical vapor deposition, chemical vapor deposition, orany other technique known in the art.

When patterning any material herein, the material to be patterned can begrown or deposited in any known manner and a patterning layer (such asan organic photoresist aka “resist”) can be formed over the material.The patterning layer (resist) can be exposed to some form of lightradiation (e.g., patterned exposure, laser exposure, etc.) provided in alight exposure pattern, and then the resist is developed using achemical agent. This process changes the characteristic of the portionof the resist that was exposed to the light. Then one portion of theresist can be rinsed off, leaving the other portion of the resist toprotect the material to be patterned. A material removal process is thenperformed (e.g., plasma etching, etc.) to remove the unprotectedportions of the material to be patterned. The resist is subsequentlyremoved to leave the underlying material patterned according to thelight exposure pattern.

For purposes herein, “sidewall structures” are structures that arewell-known to those ordinarily skilled in the art and are generallyformed by depositing or growing a conformal insulating layer (such asany of the insulators mentioned above) and then performing a directionaletching process (anisotropic) that etches material from horizontalsurfaces at a greater rate than its removes material from verticalsurfaces, thereby leaving insulating material along the verticalsidewalls of structures. This material left on the vertical sidewalls isreferred to as sidewall structures. The sidewall structures can be usedas masking structures for further semiconducting processing steps.

While the invention applies to a static random-access memory (SRAM)formed of fin field effect transistors (FinFETs), embodiments of theinvention may also be applied to a variety of semiconductor devices.Static random-access memory (SRAM) is a type of volatile semiconductormemory that uses bistable latching circuitry to store each bit.Typically, each bit in an SRAM is stored on four transistors, twopull-up (PU) transistors and two pull-down (PD) transistors that formtwo cross-coupled inverters. This memory cell has two stable stateswhich are used to denote 0 and 1. Two additional access transistors orpass-gate transistors control the access to a storage cell during readand write operations. Typically, the pulldown and pass-gate transistorsare n-channel FETs or nFETs and the pull-down transistors are p-ChannelFETs or pFETs. When the SRAMs are built with FinFET structures, the PDand PG transistors are nFinFETs and the PU transistors are pFinFETs.

Embodiments will be explained below with reference to the accompanyingdrawings.

FIG. 1 is a top view of an SRAM device comprised of a plurality ofFinFETs. The rows of the fins of PD and PG devices 101 and rows of thefins of the PU devices 103 are shown. The source and drain of thenFinFETs 105 and the source and drain of the pFinFETs 107 are created inpart by an epitaxial step. The regions 109 indicate the positions of thegates which can be fabricated of polysilicon or metal. The epitaxialgrowth step is used to create an increased volume of silicon for thesource and drain which grow on the fins 101, 103 to create the nFinFETsepitaxial regions 105 and the pFinFETs epitaxial regions 107. Epitaxy isa deposition of a crystalline overlayer on a crystalline substrate. Thefins, being composed of silicon, act as a “seed” for the epitaxialregions. The problem which the invention improves is that at the ends ofthe pFinFETs, see for example region 111, during the epitaxial growthstep, excess epitaxial silicon is grown where it is not desired. Theexcess growth causes shorts, reducing yield and presents a limitingfactor in reducing the geometry of the SRAM circuit. This problem occurswhere the fin is “cut” to create a pair of FinFETs or individual FinFETsfrom a long fin. The dashed box 113 indicates the FinFETs which comprisea single SRAM circuit.

FIG. 2 is a cross-sectional diagram depicting fin formation in theprocess of fabricating a FinFET according to a first embodiment of theinvention. FIG. 2 illustrates a point in the process after fin etch toform fin structures in the FinFET devices of FIG. 1 according to oneembodiment of the present invention. The process begins with an SOIsubstrate that includes a silicon layer 201 disposed on a buried oxide(BOX) layer (not shown). As is known to those skilled in the art othersubstrates can be used. As shown in FIG. 2, a hard mask (dielectric)layer 203 is formed on the silicon layer 201. The hard mask layer 203 ofthis embodiment is silicon nitride (SiN). A polysilicon mandrel layer(not shown) is deposited on the hard mask layer 203 and then patternedand etched. Silicon oxide structures 205 are formed on the verticalsidewalls of the polysilicon structure. Then as shown in FIG. 2, thepolysilicon structure is removed, leaving the silicon oxide structures,and the hard mask 203 and silicon layers 201 are etched to form finstructures 202 which are made of silicon and extend upward from thesilicon substrate. Other areas, where the fins are not formed, areprotected from the etch by photoresist patterned layer 207.

The oxide structures 205 are then removed, and the Shallow trenchisolation (STI) process is performed. Shallow trench isolation (STI),also known as a Box Isolation Technique, is an integrated circuitfeature which prevents electric current leakage between adjacentsemiconductor device components. The STI process uses a pattern ofetched trenches in the silicon, deposits one or more dielectricmaterials 209 (such as silicon dioxide or flowable oxide) to fill thetrenches, and removes the excess dielectric 209 using a technique suchas chemical-mechanical polishing (CMP).

FIG. 3 is a cross-sectional diagram depicting the FinFET structure afterthe local Shallow trench isolation (STI) and chemical mechanicalpolishing (CMP) processes according to a first embodiment of theinvention. In this drawing, the dielectric material 209 has beenfinished flush with the hard mask material 203 isolating the finstructures 202 from one another.

FIG. 4 is a cross-sectional diagram depicting the FinFET structure afterthe deep Shallow trench isolation (STI) etch process according to afirst embodiment of the invention. The Deep STI process, or deep trenchisolation (DTI) is similar to the STI process except that deeper andbroader trenches are formed and filled. FIG. 4 shows the result afterphotolithography and a deep etch which forms a trench 211 in the silicon201 deeper than the fin structures.

FIG. 5 is a cross-sectional diagram depicting the FinFET structure afterthe deep STI deposition of the dielectric material 213 and the chemicalmechanical polishing (CMP) process according to a first embodiment ofthe invention. As above, CMP is used to remove the excess dielectricmaterial 213 from areas outside the deep trenches so that the topsurface is flush with the hardmask.

FIG. 6A is a cross-sectional diagram depicting the FinFET structureafter patterning with a lithography process and etching to reveal a setof exposed fin ends of the FinFET structure according to a firstembodiment of the invention. FIG. 6B is a perspective drawing at thesame point in the process. This figure shows “cutting” the fin structure(in one embodiment by the combination of the lithography and etch) sothat FinFET pairs or single FinFET transistors are formed from the longfin structures. Although cutting multiple fins is shown in the drawing,in some circuits, only a single fin will be cut producing an exposed finend at a particular point. Thus, the set of fin ends can be a single finend in some embodiments of the invention. The fin ends 212 in the well(or trench) area 223 are exposed. The set of exposed fin ends 212 forpFinFETs or logic FinFETs are the locations where excess epitaxialgrowth is undesired.

FIG. 7A is a cross-sectional diagram depicting the FinFET structureafter sidewall spacer formation to avoid excessive epitaxial growth inthe fin end according to a first embodiment of the invention. FIG. 7B isa perspective drawing at the same point in the process. In one preferredembodiment, a silicon nitride (SiN) or silicon oxinitride (SiNO) spacer225 is formed. In a sidewall spacer process, the spacer is a film layerformed on the underlying features, in this case, the fin ends, the othersidewalls as well as unmasked horizontal areas. Once the sidewall spacer225 is formed by deposition of the film, etching follows to remove allthe film material on the horizontal surfaces, leaving only a layer ofthe material on the sidewalls as shown in FIGS. 7A and 7B. In someembodiments of the invention, the sidewall material is deposited in auniform thickness over the structure shown in FIGS. 6A and 6B.

In one preferred embodiment, the SiN or SiNO layer is depositedpreferentially on the silicon of the fin ends, but less or even not atall on other structures of the FinFET including the silicon oxide whichisolates the fins. Referring back to FIGS. 6A and 6B, in thisembodiment, the SiN or SiNO layer is preferentially grown on the exposedfin ends 212 (and top surface of the silicon substrate 201), but not on(or as much on) the dielectric in the shallow trenches 209 or deeptrenches 213. In this embodiment, the sidewall spacer 225 is effectivelybroken up into smaller rectangles disposed at the fin ends, rather thanthe large rectangle shown in FIGS. 7A and 7B. Where some sidewallmaterial is grown on the dielectric, there will be a large rectangle,however, the sidewall material will be thicker at the fin ends than overthe dielectric.

After the sidewall spacer is formed, oxide 227 is deposited in the wellsat the fin ends and a CMP process is used to remove excess oxide. Then,in the fin recess process, an etch is used to partially reveal the finsfor further processing. FIG. 8A is a cross-sectional diagram depictingthe FinFET structure after the etch process of the oxide, reveal theprotected fin structure for further processing according to a firstembodiment of the invention. FIG. 8B is a perspective drawing at thesame point in the process. In one preferred embodiment, the oxide is aflowable oxide.

As shown in FIGS. 8A and 8B, the spacer material 225 is preferably onlyat the exposed fin ends at this point in the process. The etch used isselective to the dielectric layer 209, e.g., oxide, as compared to thesidewall material, e.g., SiN. Even so, the etch process is used tocleanup the sidewall material between the fins where it is deposited onthe dielectric. For those portions of the sidewall material 225 on thedielectric 209, the sidewall material 225 is etched on both sides as theoxide 209 in the trenches is etched away. The etch rate of the spacermaterial is sufficient to etch away the relatively thin sidewall betweenthe fins. On the other hand, the sidewall material 225 at the fin endsis protected on one side by the fin, etching more slowly, and thusremains intact at the fin ends. In the embodiment discussed above wherethe SiN or SiNO was grown preferentially on the silicon as opposed tothe oxide, there was less to no spacer material to be etched away overthe oxide 209, so in this embodiment, it would be easier than the fullsidewall spacer embodiment from a cleanup perspective. The spacermaterial 225 at the fin ends prevents epitaxial growth from that portionof the fin, while allowing the sidewalls of the fin to provide the“seed” for epitaxial growth for the source and drain.

In FIG. 9A, a second embodiment of the invention is shown. FIG. 9B is aperspective drawing at the same point in the process. The processing forthe second invention is similar to that shown in FIGS. 2-6 for the firstinvention. Then after the fins are cut, by photo lithography and etch asshown FIGS. 9A and 9B, the exposed fin ends 212 of the FinFET structureare exposed to plasma nitridation and/or high dose implantation(portrayed as arrows 233) to create an inhibitory layer which inhibitsexcessive epitaxial growth at the fin ends. Different embodiments of theinvention will use either plasma nitridation or high dose implantation;some embodiments of the invention can use both processes in combination.A plasma nitridation process will form a SiN layer on the exposed fintip to prevent epitaxial growth. The high dose implantation can usezirconium (Zr) or argon (Ar) ions to create a thin amorphous siliconlayer at the fin end 212. Those skilled in the art will recognize thatother ions can be used in the implantation process. Amorphous silicon isnot as good a “seed” as crystalline silicon, so the amorphous siliconlayer will slow down the epitaxial growth at the fin ends.

In the second embodiment, after the plasma nitridation or high doseimplantation, the remaining processing is similar to that depicted inFIG. 8, namely oxide is deposited in the wells at the fin ends and a CMPprocess is used to remove excess oxide. Then, an etch is used topartially reveal the fins for further processing.

The invention has several benefits over the prior art. By preventingepitaxial growth at the fin ends of a FinFET, the dimensions of theintegrated circuit can be reduced as the spacing between the active PUFinFETs is not as much of a limiting factor. In addition, the yield ofSRAMs built according to the prevent invention is improved.

While only one or a limited number of features are illustrated in thedrawings, those ordinarily skilled in the art would understand that manydifferent types features could be simultaneously formed with theembodiment herein and the drawings are intended to show simultaneousformation of multiple different types of features. However, the drawingshave been simplified to only show a limited number of features forclarity and to allow the reader to more easily recognize the differentfeatures illustrated. This is not intended to limit the inventionbecause, as would be understood by those ordinarily skilled in the art,the invention is applicable to structures that include many of each typeof feature shown in the drawings.

While the above describes a particular order of operations performed bycertain embodiments of the invention, it should be understood that suchorder is exemplary, as alternative embodiments may perform theoperations in a different order, combine certain operations, overlapcertain operations, or the like. References in the specification to agiven embodiment indicate that the embodiment described may include aparticular feature, structure, or characteristic, but every embodimentmay not necessarily include the particular feature, structure, orcharacteristic.

In addition, terms such as “right”, “left”, “vertical”, “horizontal”,“top”, “bottom”, “upper”, “lower”, “under”, “below”, “underlying”,“over”, “overlying”, “parallel”, “perpendicular”, etc., used herein areunderstood to be relative locations as they are oriented and illustratedin the drawings (unless otherwise indicated). Terms such as “touching”,“on”, “in direct contact”, “abutting”, “directly adjacent to”, etc.,mean that at least one element physically contacts another element(without other elements separating the described elements).

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

The corresponding structures, materials, acts, and equivalents of allmeans or step plus function elements in the claims below are intended toinclude any structure, material, or act for performing the function incombination with other claimed elements as specifically claimed. Thedescription of the present invention has been presented for purposes ofillustration and description, but is not intended to be exhaustive orlimited to the invention in the form disclosed. Many modifications andvariations will be apparent to those of ordinary skill in the artwithout departing from the scope and spirit of the invention. Theembodiment was chosen and described in order to best explain theprinciples of the invention and the practical application, and to enableothers of ordinary skill in the art to understand the invention forvarious embodiments with various modifications as are suited to theparticular use contemplated.

Having described our invention, what we now claim is as follows:
 1. Astructure for preventing epitaxial growth in a semiconductor devicecomprising: a set of fins of a FinFET structure, each fin of the set offins having a fin end with a fin end face and a pair of sidewallsoriented orthogonally to the fin end face; a dielectric with covers alower portion of the set of fins including a lower portion of the finend faces and a lower portion of the pairs of sidewalls, an upperportion of the set of fins being free of the dielectric; a set ofsidewall spacers formed on the fins end faces of the set of fin, forminga set of spacer covered fin ends, on the upper portion of the set offins, each sidewall spacer of the set of sidewall spacers is formed onlyon the fin end face and the pair of sidewalls are free from the sidewallspacers; and a larger rectangular sidewall spacer disposed on the lowerportion of the fin end faces of the set of fins and bridging the fin endfaces of the set of fins and the dielectric which covers the lowerportion of the set of fins, wherein the set of sidewall spacers are aset of smaller rectangular spacers and the set of sidewall spacers andthe larger rectangular sidewall spacer are formed from a first layer ofsidewall material, wherein the set of sidewall spacers prevent epitaxialgrowth at the set of spacer covered fin ends and areas of the pairs ofsidewalls provide a seed for epitaxial growth.
 2. The structure asrecited in claim 1 wherein the set of sidewall spacers are formed from aconformal layer of sidewall spacer material over the FinFET structurewhich is selectively etched from areas other than vertical surfaces ofthe fin ends.
 3. The structure as recited in claim 2, wherein thedielectric comprises a set of silicon oxide spacer regions separatingthe set of fins.
 4. The structure as recited in claim 3, wherein siliconoxide spacer material of the set of silicon oxide regions is at a firstheight lower than a second height of the set of fins so that a portionof the set of fins is exposed to provide a seed for epitaxial growth. 5.The structure as recited in claim 2, which further comprises a set ofFinFET devices arranged in an SRAM device.
 6. The structure as recitedin claim 2, wherein the conformal layer of sidewall spacer material isSiNO.
 7. The structure as recited in claim 2, wherein the conformallayer of spacer material is comprised of a SiN layer on the set ofexposed fin ends to prevent epitaxial growth.
 8. The structure asrecited in claim 1, wherein the structure is used to form a set ofFinFET devices and one of the set of FinFET devices is a component of alogic device.
 9. The structure as recited in claim 8, wherein at leastone of the set of FinFET devices is a pFinFET device.
 10. The structureas recited in claim 2, wherein the conformal layer of spacer material iscomprised of SiN and the set of fin structures are isolated from eachother by shallow trench isolation dielectric structures.